Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%) в рублях |
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Electronic paper displays - Part 1-1: Terminology
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Electronic paper display - Part 3-2: Measuring method - Electro-optical
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Electronic paper displays - Part 4-2: Environmental test methods
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Flexible display devices - Part 5-1: Measuring methods of optical performance
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Flexible display devices - Part 6-1: Mechanical test methods - Deformation tests
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Flexible display devices - Part 6-3: Mechanical test methods - Impact and hardness tests
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Low resistance measurements - Methods and guidance
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Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
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Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
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Device embedded substrate - Part 1-1: Generic specification - Test methods
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Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
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Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 2: Phase jitter measurement method
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Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods
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Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 4: Short-term frequency stability test methods
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Printed electronics - Part 201: Materials - Substrates
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Printed electronics - Part 202: Materials - Conductive ink
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Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films Contactless method
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Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
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Printed electronics - Part 401: Printability - Overview
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